Method of making a lead frame
US4204317A · kind A · utility
83Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1977 |
| Grant date | May 27, 1980 |
| Priority date | — |
| Expiry date | Nov 18, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of making a metal lead frame wherein a metal lead frame blank is stamped or etched from a metal strip so as to provide a die attach pad and a plurality of leads attached to the pad. Prior to separating the leads from the pad a retainer is applied to the leads adjacent the pad so that the leads are held in fixed positions during and after their separation from the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.