Patent · US Expired

Apparatus for machining workpieces by abrasion

US4204515A · kind A · utility

3Cited by

1References

4Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Dieter Seifert · Vilshofen an der Donau, DE
Dieter Regler · Burghausen, DE
Volker Ofenmacher · Burghausen, DE
Alfred Moritz · Burghausen, DE
August Freudlsperger · Neuötting, DE
Walter Berger · Overland Park, US

Key dates

Filing date	Aug 17, 1978
Grant date	May 27, 1980
Priority date	—
Expiry date	Aug 17, 1998

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/042
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Apparatus for machining workpieces by abrasion by means of an oscillating ltiple-blade tool, which is moved across the workpiece. The moved masses define an oscillatory system, as a result of which the energy can be stored in the reversal ranges by a buffer system. This apparatus, especially when designed as a lap-cutting machine for cutting semiconductor rods, is preferably driven by the oscillation of the masses to be moved, and is driven in the resonance range. The tool carriages are buffer loaded at each end and are oscillated at or near the natural resonance frequency of the moving masses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.