Soluble photosensitive resin composition
US4209581A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1978 |
| Grant date | Jun 24, 1980 |
| Priority date | — |
| Expiry date | Sep 25, 1998 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2559/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A photocurable soluble resin suitable for manufacturing photosensitive resin plates obtained by polycondensing an alkylol derivative or an alkylated alkylol derivative of urea or thiourea with an N-alkylolacrylamide or N-alkylolmethacrylamide in the presence of an acid or an ammonium salt thereof or by reacting urea or thiourea with formaldehyde to form a linear polycondensation product and then grafting an N-alkylolacrylamide or N-alkylolmethacrylamide on the linear polycondensation product in the presence of an acid or an ammonium salt thereof. This soluble resin is incorporated with known soluble resins such as soluble nylon, photosensitizers and thermal polymerization inhibitors and mixed thoroughly to obtain a soluble photosensitive resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.