Module for integrated circuits
US4209798A · kind A · utility
15Cited by
11References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 21, 1979 |
| Grant date | Jun 24, 1980 |
| Priority date | — |
| Expiry date | Mar 21, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal foil carrying a semiconductive chip, encased in a resinous body of generally rectangular outline, has a solid portion extending within the body from the region of the chip toward or beyond a major side of that body and terminates in a set of exposed, bent-over tongues symmetrically duplicating a set of conductor strips which are tied to respective chip terminals and pass outwardly along the opposite major side of the body. The solid foil portion and/or the tongues integral therewith are in contact with a heat-dissipating member disposed outside the resinous body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.