Multilayer circuit board construction and method
US4211603A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 1, 1978 |
| Grant date | Jul 8, 1980 |
| Priority date | — |
| Expiry date | May 1, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Multilayer circuit boards having large area through-hole electrical connections are provided by a process that begins with the fabrication by known means of a drilled and through-hole plated single layer board. Next, a layer of insulating material is applied to either side of the board, leaving at least the through-hole plating exposed. A continuous layer of metal is then deposited on the body, completely covering the insulating layer and through-hole plating. Finally, the deposited metal layer is selectively masked and etched to form conductive circuit patterns on the insulating layer, overlying the original circuit patterns and electrically connected to them by the multiple layer through-hole plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.