Hermetic and non-hermetic packaging of devices
US4214364A · kind A · utility
28Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1979 |
| Grant date | Jul 29, 1980 |
| Priority date | — |
| Expiry date | May 21, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the packaging of devices, such as active and passive electronic devices, the devices can be selectively hermetically sealed or non-hermetically sealed, as desired, using to a large extent common apparatus. In the limit, only the fusion sealing for hermetic devices and plastic encapsulation for non-hermetic devices need be carried out on separate machines. This is obtained by use of a particular form of lead frame, common for both forms of devices, with common apparatus and steps prior to and following the sealing or encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.