Winged self-fastened heat sinks for semiconductor devices
US4215361A · kind A · utility
41Cited by
6References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1978 |
| Grant date | Jul 29, 1980 |
| Priority date | — |
| Expiry date | Sep 12, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat accumulating about the plastic housing and metallic tab of a miniature electronic semiconductor power device is dissipated by a surrounding one-piece sheet metal heat sink shaped as a closely-fitting channel portion closed at the bottom but open-slotted midway along the top; from margins of the top slot, a pair of integral fingers spring downwardly to engage and hold a plastic semiconductor package within it, and from the same margins a pair of upwardly and laterally-flaring spaced broad-area fins are also spread to enhance transfer of heat away from the site at which a tab of a device is held within.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.