Adhesive composition
US4217435A · kind A · utility
13Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1978 |
| Grant date | Aug 12, 1980 |
| Priority date | — |
| Expiry date | Aug 28, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/934
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Composition especially useful as an interlining adhesive comprising a blend of a polyester and a polyamide. The polyester is derived from at least about 40 moles percent terephthalic acid, has a melting point of between about 90.degree. C. and about 140.degree. C. and a heat of fusion of from about 0.1 to about 10 calories per gram. The polyamide has a melting point of between about 50.degree. C. and about 200.degree. C. Such a composition may be melt blended and cryogenically ground to a fine powder size and is resistant to blocking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.