Thin-film microcircuits adapted for laser trimming
US4217570A · kind A · utility
38Cited by
5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 30, 1978 |
| Grant date | Aug 12, 1980 |
| Priority date | — |
| Expiry date | May 30, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Microcircuit structures including thin-film electrical components are provided with a multilayer passivation coating that permits laser trimming of the components through the coating without damaging it. Such a passivation coating suitably includes an underlayer of silicon oxide or other oxygen-containing material and an outer layer of silicon nitride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.