Bonding method employing film adhesives containing an epoxide resin
US4218279A · kind A · utility
22Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 27, 1978 |
| Grant date | Aug 19, 1980 |
| Priority date | — |
| Expiry date | Jun 27, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A layer of a liquid composition containing an epoxide resin as the sole photopolymerizable component, a heat-activated curing agent for epoxide resins, and preferably a photopolymerization catalyst, is exposed to actinic radiation until the layer solidifies to form an essentially solid, continuous film due to photopolymerization of the epoxide resin through epoxide groups, the resin remaining, however, still thermosettable by virtue of residual epoxide groups. The film so formed is sandwiched between, and in contact with, surfaces to be bonded together, and the assembly is heated to cure the epoxide resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.