Thin film magnetic head assembly
US4219854A · kind A · utility
37Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1978 |
| Grant date | Aug 26, 1980 |
| Priority date | — |
| Expiry date | Dec 21, 1998 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/313
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film magnetic head assembly has a multi-turn electrical conducting coil, which is formed by deposition in an elliptical pattern. By virtue of the elliptical pattern, the coil turn portions between the back gap closure and transducing gap of the thin film head are relatively narrow, whereas the coil turn portions furthest from the transducing gap are widest. Corners and sharp ends are eliminated. Electrical resistance effects are thereby minimized and signal output is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.