Multilayered glass-ceramic substrate for mounting of semiconductor device
US4221047A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1979 |
| Grant date | Sep 9, 1980 |
| Priority date | — |
| Expiry date | Mar 23, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.