Patent · US Expired

Method of manufacturing a contact bridge

US4222167A · kind A · utility

0Cited by

10References

2Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Heinrich Hassler · Wendelstein, DE
Joachim Grosse · Erlangen, DE
Gert Fischer · Feldafing, DE
Joachim Hannich · Amberg, DE

Key dates

Filing date	Apr 25, 1978
Grant date	Sep 16, 1980
Priority date	—
Expiry date	Apr 25, 1998

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49208
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a contact bridge for an electric switching apparatus which contact bridge includes an electrically highly conductive overlay and a concave-shaped support layer. The method comprises the steps of pressing a powder blank comprising two layers of metallic material, one of which comprises iron for the support layer and the other of which comprises copper for the overlay; sintering the blank in a protective gas; sizing the blank; further sintering the blank in a protective gas; further pressing the blank by reverse-flow cup extrusion; and applying an electrical contact to the overlay. Alternatively, the powder blank may comprise a layer of copper-zirconium and silver-metal oxide, the latter for an electrical contact layer. In this embodiment, the contact bridge is formed with the electrical contact in one step and there is no need to apply a contact to the bridge after the pressing by reverse-flow cup extrusion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.