Mounting assembly for semiconductive controlled rectifiers
US4224663A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1979 |
| Grant date | Sep 23, 1980 |
| Priority date | — |
| Expiry date | Feb 1, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/909
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting assembly for press-pack semiconductive controlled rectifiers wherein the rectifiers are all thermally connected to the same heat sink using an insulating medium, the rectifiers being electrically interconnected using common bus bars as required to provide a desired alternating current or direct current connection. A common spring arrangement is used to apply appropriate pressure to at least two semiconductors at once to hold them in contact with their associated bus bars. At least one of the interconnecting bus bars for the rectifiers is formed of a malleable conducting medium, such as copper, formed and used in a manner to provide load equalizing and surface alignment such that the spring can transmit uniform pressure to the heat sink and the semiconductive controlled rectifiers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.