Thin-film microcircuit board
US4227039A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1978 |
| Grant date | Oct 7, 1980 |
| Priority date | — |
| Expiry date | Oct 23, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby removing exposed portions of the thin-film laminate as a result of dispersion and evaporation thereof. Unexposed portions of the thin-film laminate provide a desired pattern. The electrical property-imparting film is a thin-film of noble metal such as gold, silver or platinum or a thin film of transparent electrode material such as SnO.sub.2 or In.sub.2 O.sub.3, which is not easily dispersible upon application of the above energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.