Dual plane barrier-type two-phase CCD
US4227202A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1977 |
| Grant date | Oct 7, 1980 |
| Priority date | — |
| Expiry date | Oct 27, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/147
Abstract
A charge coupled device having geometries suitable for fabrication in high density packages (64,000 bits per chip--1,000,000 bits per chip) is comprised of a semiconductor substrate having dopant impurity atoms of a first type and a first surface. A charge transfer channel lies in the substrate near the first surface; and it is overlaid by an insulating layer of non-uniform thickness. A plurality of first and second electrodes lie on the insulating layer traversely to the channel. A barrier region of dopant impurity atoms of the first type lies under each of the electrodes. The non-uniform insulating layer underlies each of the first electrodes by a first uniform thickness, underlies the second electrodes by a second uniform thickness, and separates the each of the first and second electrodes by approximately the second thickness. The second thickness is 20%-60% greater than the first thickness to greatly reduce inter-electrode shorts in high density packages. A shallow layer of dopant atoms of a second type opposite to the first type may be provided under the second electrodes to compensate for flatband voltage shifts due to the thick insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.