Conductive molding composition
US4228050A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 1979 |
| Grant date | Oct 14, 1980 |
| Priority date | — |
| Expiry date | Jan 15, 1999 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B9/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved molding composition having a bulk resistivity below about 500 ohm-cm at 900 megahertz for compression molding video discs comprising sufficient conductive carbon black particles to obtain the desired conductivity, from about 1.5 to 4 percent by weight of stabilizers, from about 1 to 3 percent by weight of at least two lubricants, up to 10 percent by weight of plasticizers and processing aids, the remainder being a polyvinylchloride based resin, with the proviso that not more than about 5 percent by weight of liquid additives are present in said molding composition. Video discs molded from said composition have improved dimensional stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.