Rapid setting high bond strength adhesive
US4228062A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1978 |
| Grant date | Oct 14, 1980 |
| Priority date | — |
| Expiry date | May 2, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a rapid setting adhesive of low toxicity having high bond strength to a variety of metals and plastics, and particularly to stainless steel, polycarbonate plastics and tooth enamel. The composition consists essentially of (A) a resin which is formed from an ester of methacrylic acid with a monoalcohol containing at least one epoxy group and (B) a filler which may be any of a plurality of finely divided materials that are insoluble in ambient fluids or a mixture of such fillers, parts (A) and (B) being present in a weight ratio such that the initial mixture at ambient temperature and pressure is a viscous liquid or paste. Also included are minor amounts of a conventional polymerization catalyst and a conventional polymerization accelerator. Preferably parts (A) and (B) are packaged separately, with polymerization catalyst included in only one package. In one embodiment of the invention, to insure thermostability at elevated temperatures, about 10 to about 80 parts by weight, per 100 parts of (A) plus (B), of an aliphatic or aromatic dimethacrylate is added as a cross-linking agent. In a preferred embodiment (A) is glycidyl methacrylate. Many variations are possible with…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.