Resin composition having low shrink properties
US4228251A · kind A · utility
10Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1978 |
| Grant date | Oct 14, 1980 |
| Priority date | — |
| Expiry date | Nov 30, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition which comprises (A) 50 to 90 parts by weight of an unsaturated ester oligomer produced by reacting a glycol, hydroxylated dicyclopentadiene, and at least one unsaturated dibasic acid or anhydride thereof until an acid value of less than 40, (B) 50 to 10 parts by weight of one or more polymerizable monomers, and (C) 3 to 15 parts by weight of polystyrene based on 100 parts by weight of the total of the components (A) and (B), can give molded articles having low shrink properties and improved color shading, cracks, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.