Process for implanting radioactive metal on a substrate
US4228338A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1978 |
| Grant date | Oct 14, 1980 |
| Priority date | — |
| Expiry date | Jun 8, 1998 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K11/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for implanting a precise quantity of radioactive metal on a metal substrate such as a cutting tool or other metal part subject to wear at the area or areas where the part is expected to wear during its operation. The presence of the radioactive spot can be sensed to determine the extent of wear during use. The radioactive metal is deposited from a wire formed of a core of the radioactive metal surrounded by a sheath of metal having a high thermal and electrical conductivity relative to the core. In operation, the wire contacts the metal surface under pressure and electric current is passed through the wire in order to (1) form a pit on the tool surface, (2) weld the radioactive metal in the pit and (3) evaporate a small portion of the conductive sheath adjacent the pit. A second current then is passed through the wire to break it near the bottom of the pit, leaving a small quantity of radioactive material welded to the bottom of the pit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.