Thin film structure on a ribbon substrate for electric components and manufacture thereof

US4229476A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Herbert Forster · Schorndorf, DE
• Dieter Bayer · Böblingen, DE

Key dates

• Filing date: Mar 20, 1979
• Grant date: Oct 21, 1980
• Expiry date: Mar 20, 1999

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24934
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

In the manufacture of devices using a metal film deposited on a substrate of paper or synthetic resin sheet or strip material, an advantage has been found with respect to promoting adherence and resisting corrosion, when an intermediate layer is used that does not completely cover the substrate but leaves gaps between covered areas or islands. The top layer, which covers the exposed areas of the substrate and the intermediate layer, is aluminum, zinc, cadmium or zinc-cadmium. The patchy intermediate layer is an oxide or a mixture of oxides of tungsten, lead, antimony, bismuth. Oxides of certain other metals and silicon and boron oxides are also usable. Both the oxide layer and the metal layer can be vapor-deposited on a moving strip of the substrate at a foreign gas pressure of up to 1 torr. in a single pass of the substrate strip through the vacuum chamber. The oxide can be thermally deposited by vaporizing the oxide in question in vacuum or it can be formed by the action of residual oxygen or water vapor on the corresponding atoms of pure metals vaporized in the vacuum for deposition.