Copolyamide resins from piperazine and polyoxyalkylene diamine having improved creep resistance
US4229567A · kind A · utility
7Cited by
4References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 8, 1979 |
| Grant date | Oct 21, 1980 |
| Priority date | — |
| Expiry date | Feb 8, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31783
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Copolyamides derived from a mixture of short-chain and long-chain saturated aliphatic dicarboxylic acids, piperazine and a polyoxyalkylene diamine are excellent hot melt adhesives useful with a variety of substrates. These thermoplastic copolyamide resins are particularly useful adhesives for vinyl materials and are resistant to creep.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.