Treating multilayer printed wiring boards
US4230553A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1979 |
| Grant date | Oct 28, 1980 |
| Priority date | — |
| Expiry date | Apr 23, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In the past, the residual smear was removed by wet etching. A technique is described using plasma etching with the conductive surface layers of the drilled boards as the electrodes to generate the plasma. The plasma forms directly within the holes and effectively removes the smear. A dielectric material in contact or close proximity to the perimeter of each board provides uniformity of treatment over the panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.