Bonding electronic component to molded package
US4230754A · kind A · utility
13Cited by
11References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1978 |
| Grant date | Oct 28, 1980 |
| Priority date | — |
| Expiry date | Nov 7, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component with leads attached is cleaned, a layer of an epoxy or epoxy-reactive silane is applied and cured, and then the package material is molded on. The silane layer bonds the component to the package and provides a fluid-tight seal therebetween. The silane is gamma-glycidoxypropyl- or gamma-aminopropyltrimethoxy or triethoxy silane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.