Copper alloy brazing paste
US4231815A · kind A · utility
10Cited by
2References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 9, 1979 |
| Grant date | Nov 4, 1980 |
| Priority date | — |
| Expiry date | Aug 9, 1999 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/302
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Copper-manganese alloy brazing pastes can be substantially improved by the inclusion of a minor amount of silicon in the alloy. The brazing alloy can contain by weight between about 0.5% and 3% silicon to provide a brazing composition for brazing at temperatures between about 1650.degree. C. and 1850.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.