Methods for determining bond failure modes using stress wave emission techniques
US4232558A · kind A · utility
9Cited by
4References
8Claims
0Family size
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Key dates
| Filing date | Apr 12, 1979 |
| Grant date | Nov 11, 1980 |
| Priority date | — |
| Expiry date | Apr 12, 1999 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N29/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
As leads that have been thermocompressively bonded to ceramic substrates are pulled to destruction, stress waves are monitored and counted. The total count is compared to empirically developed ranges associated with known failures to determine the failure mode (e.g., lead failure, gold-to-gold failure, ceramic pullout).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.