Method for enhanced heat transfer
US4232728A · kind A · utility
5Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1979 |
| Grant date | Nov 11, 1980 |
| Priority date | — |
| Expiry date | Feb 26, 1999 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F13/08
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An inner surface substrate of metal tubes is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other, and substantially surrounded by the substrate to form body void space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.