High resistivity electroconductive tin oxide films
US4235945A · kind A · utility
4Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1978 |
| Grant date | Nov 25, 1980 |
| Priority date | — |
| Expiry date | Dec 1, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/112
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method is disclosed for pyrolytically forming electroconductive tin oxide films having higher resistivity for a given thickness than tin oxide films formed by known methods by adding to the film forming solution an organic compound which retards the rate of film formation reducing the particle size of the tin oxide film thus increasing the resistivity of the film. Small quantities of an organic compound such as cresol or benzyl alcohol added to the film-forming solution may increase the resistivity by a factor of five for a typical film thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.