Process for forming printed wiring by electroless deposition
US4239813A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1979 |
| Grant date | Dec 16, 1980 |
| Priority date | — |
| Expiry date | Apr 25, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1605
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subjecting to the conventional treatments for electroless deposition so as to form prescribed wiring on the portions not exposed to actinic light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.