Patent · US Expired

Lap cutting abrasive

US4246003A · kind A · utility

8Cited by

4References

6Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Dieter Regler · Burghausen, DE
Alfred Moritz · Burghausen, DE

Key dates

Filing date	Aug 3, 1979
Grant date	Jan 20, 1981
Priority date	—
Expiry date	Aug 3, 1999

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC30B33/00
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A lap cutting abrasive for use with lap cutting blades, comprising one part y weight of a low viscosity carrier liquid, and one to three parts by weight of cutting particles having an average size of from 10 to 50 .mu.m suspended in the carrier liquid. The carrier liquid has a viscosity of from 1 to 10 cP, and preferably is aqueous glycerin. The cutting particles preferably have an average particle size of from 15 to 30 .mu.m. In a further embodiment, the average particle size of the cutting particles is matched to the thickness of the lap cutting blade used during sawing. Preferably, the cutting particles have an average particle size corresponding to 0.15 to 0.1 times the thickness of the lap cutting blade used during sawing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.