Interpenetrating dual cure resin compositions
US4247578A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1978 |
| Grant date | Jan 27, 1981 |
| Priority date | — |
| Expiry date | Sep 25, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2270/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable resin compositions are prepared containing a radiation-sensitive reactive diluent and a saturated polyol. Curing is accomplished by mixing the reactive diluent and the polyol with a polyisocyanate, followed by exposure of the resultant composition to radiation to polymerize the reactive diluent and then, by thermal curing, to form the hydroxyisocyanate (urethane) linkage. The fully cured resin composition is described as interpenetrated or one in which there is no cross-linking between the reactive diluent and urethane linked co-polymer. The interpenetrated resin compositions form tough and hard coatings on various substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.