Blank beam leads for IC chip bonding
US4247623A · kind A · utility
14Cited by
10References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 18, 1979 |
| Grant date | Jan 27, 1981 |
| Priority date | — |
| Expiry date | Jun 18, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-layer blank and a process are disclosed for the formation of frames of metal beam leads that are bonded to integrated circuit chips. The blank incorporates an improved negative-working resist having adhesion to the metal as well as flexibility. The process of forming the leads includes the step of fully photopolymerizing the resist to avoid outgassing of residual monomer as would otherwise occur during bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.