Heat-activated adhesive
US4248748A · kind A · utility
33Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1980 |
| Grant date | Feb 3, 1981 |
| Priority date | — |
| Expiry date | Feb 4, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31844
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Heat-activated adhesive comprising a pressure-sensitive-adhesive acrylate polymer and a tackifying resin, the latter being included in sufficient amount to lower the pressure-sensitive adhesion of the complete heat-activated adhesive to levels needed for convenient and effective room-temperature handling of sheets coated with the adhesive, while leaving the adhesive with the capacity for strong heat-activated bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.