Apparatus and process for producing copper-boron carbide composite by electrolytic entrapment
US4249998A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 24, 1979 |
| Grant date | Feb 10, 1981 |
| Priority date | — |
| Expiry date | Aug 24, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D15/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vertical electrolytic cell for producing a composite layer of boron carbide-filled copper by codeposition of copper and boron carbide particles. A metal substrate serving as a cathode is positioned below a copper anode in an electrolyte containing copper ions. Boron carbide particles are introduced beneath the copper anode, uniformly distributed in the electrolyte and allowed to settle onto the substrate surface while electroplating so that the particles become entrapped in a growing copper matrix. The preferred apparatus includes a plurality of stirrers. One feature of the preferred procedure is to introduce the total volume of boron carbide particles by adding a little at a time, shutting off the stirrers and plating through a settling layer of carbide particles before adding the next batch of particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.