Heating and cooling apparatus for a building
US4250957A · kind A · utility
9Cited by
7References
5Claims
0Family size
Inventor
Key dates
| Filing date | Nov 1, 1979 |
| Grant date | Feb 17, 1981 |
| Priority date | — |
| Expiry date | Nov 1, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heating and cooling structural arrangement for a building, such as a house, wherein the interior of the house is caused to assume the temperature of the ground. A liquid reservoir is located in the ground. A pump is to move liquid from the reservoir to a series of panels which are mounted as part of the interior wall structure of the building. If the ground temperature is 70 degrees, this means that the interior temperature of the house should also become 70 degrees. In the winter, the interior of the building would normally be heated and in the summer, the interior of the building would normally be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.