High temperature pipe insulation
US4251590A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1979 |
| Grant date | Feb 17, 1981 |
| Priority date | — |
| Expiry date | Jun 18, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2992
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to pipe insulation useful at relatively high temperatures, e.g., 850.degree. F. Mineral fibers bonded with phenol-formaldehyde resins and conventional anti-punking liquid resin systems have been developed as a means of producing thermal insulation of relatively low density. However, sustained punking of the binders employed caused exothermic reactions whose temperatures fused the low density mineral fibers causing thermal and structural degradation of the insulation. The present invention utilizes a relatively dense layer of fiber glass having a relatively low binder content, bonded with a binder comprising an antipunk phenolic resin and high levels of silane based on the solids content in the resin. An outer layer may surround the dense layer and be constructed with a lower density and a higher binder content.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.