Method of manufacturing a target assembly for a camera tube
US4251909A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 9, 1979 |
| Grant date | Feb 24, 1981 |
| Priority date | — |
| Expiry date | May 9, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J31/46
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A target and target assembly for a camera tube in which a semiconductor plate is provided on an annular support. The plate has a semiconductor monocrystalline edge portion which comprises an integrated circuit for processing the electrical signals originating from the target. The central portion of the plate is provided with a radiation-sensitive layer having one or more radiation-permeable electrodes. The integrated circuit is provided with inputs which are connected to the electrodes and with leads for the supply and control voltages. A window is provided on the electrodes and overlaps the inner edge of the support, the window, the edge portion and the support adjoining each other in a vacuum-tight manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.