Cathode sputtering with multiple targets
US4252626A · kind A · utility
20Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1980 |
| Grant date | Feb 24, 1981 |
| Priority date | — |
| Expiry date | Mar 10, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and methods for depositing a coating on a substrate are disclosed. Cathode sputtering techniques for rapidly depositing a relatively thick coating, of controllable and variable composition using multiple cathodes on a substrate having a complex geometry are developed. The apparatus employed includes a sputtering chamber formed between a center, post cathode, a hollow cylindrical cathode and supplemental cathode targets of a different composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.