Bonding composition and microwave process for bonding together plastic components
US4253898A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1979 |
| Grant date | Mar 3, 1981 |
| Priority date | — |
| Expiry date | Dec 17, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31928
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A bonding composition comprised of a plastisol and from 10 to 100 parts by weight per 100 parts by weight of vinyl polymer resin in the plastisol of a polar material having a dielectric constant above 35 at 20.degree. C. is used for bonding together plastic components, such as vinyl polymer components. The bonding composition is interposed between and in contact with the plastic components which are to be bonded together. Then, the composite structure is exposed to electromagnetic energy having a wave length between about 0.001 to 0.3 meter for about 1/4 minute to 5 minutes. The electromagnetic energy heats the bonding composition to a temperature at which fusion of the bonding composition occurs and to a temperature sufficient to cause melting of the surfaces of the plastic components in contact with the bonding composition. Upon cooling the composite structure, a strong bond between the components has occurred.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.