Epoxy resin composition
US4254000A · kind A · utility
8Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1979 |
| Grant date | Mar 3, 1981 |
| Priority date | — |
| Expiry date | Oct 26, 1999 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C33/62
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition which comprises (1) an epoxy resin represented by the formula: ##STR1## wherein n is an integer of 4 to 18 and (2) at least one of an initial condensation product of amino resin, an initial condensation product of amide resin and an initial condensation product of phenol-formaldehyde, which can afford hardened products being improved in contamination-preventing property, particularly adhesion resistance at high temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.