Process for preparing epoxy laminates for additive plating
US4254186A · kind A · utility
12Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1978 |
| Grant date | Mar 3, 1981 |
| Priority date | — |
| Expiry date | Dec 20, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for preparing an epoxy impregnated laminate having an adhesive surface conductive to electroless plating wherein the adhesive surface is applied from a transfer sheet as a substantially uncured phenolic thermosetting resin/nitrile rubber polymer adhesive layer which is thereafter cured by subjecting the laminate to heat and pressure curing conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.