Integrated circuit heat dissipator
US4254447A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 10, 1979 |
| Grant date | Mar 3, 1981 |
| Priority date | — |
| Expiry date | Apr 10, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit heat dissipator is provided which will additionally hold the integrated circuit in a printed circuit board prior to soldering. The heat dissipator is comprised of a single elastic piece of metallic material having oppositely facing sides joined by a fold at the top. A tab is located at the bottom of each of the sides which is suitable for insertion into a printed circuit board. The tabs have a width which allows them to contact only the heat-conducting pins of the integrated circuit. The heat dissipator is mounted adjacent to the integrated circuit with one of the tabs contacting the heat-conducting pins. The elastic material gives the heat dissipator a spring-like property which causes the tabs to press outwardly from each other when inserted in a board so as to fixedly hold the heat dissipator and the integrated circuit in the printed circuit board prior to soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.