Composition for sensitizing articles for metallization
US4259113A · kind A · utility
9Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1978 |
| Grant date | Mar 31, 1981 |
| Priority date | — |
| Expiry date | Feb 21, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1893
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with a liquid containing an activatable complex of copper. The copper-containing complexes of the instant invention are the product of forming solutions comprising a halogen component, a cuprous component and a cupric component. The solutions may optionally be in contact with elemental metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.