Fine line repair technique
US4259367A · kind A · utility
51Cited by
7References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 30, 1979 |
| Grant date | Mar 31, 1981 |
| Priority date | — |
| Expiry date | Jul 30, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Repair of opens and shorts in semiconductor packages and chip metallurgy by initial conversion of shorts into opens by severing of lines about the shorts, followed by interconnection of conductor patch lines to the good circuit portions through an insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.