Electroless plating process for glass or ceramic bodies and product
US4259409A · kind A · utility
33Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 6, 1980 |
| Grant date | Mar 31, 1981 |
| Priority date | — |
| Expiry date | Mar 6, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Strongly adherent layers of electroless metals on glass or ceramic substrates are obtained by first applying a film of an alkali metal silicate solution containing dissolved therein a catalytically effective amount of nickel, palladium or platinum to the substrate, drying and firing the film onto the substrate and electroless plating the coated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.