Clamp for securing an encased power frame to a heat sink
US4259685A · kind A · utility
30Cited by
6References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 8, 1979 |
| Grant date | Mar 31, 1981 |
| Priority date | — |
| Expiry date | Mar 8, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, comprising a lead frame connected to an IC chip in a resinous block and a metallic strip projecting unilaterally from that block along a heat sink, is fastened to that heat sink by a screw traversing aligned holes in the projecting strip portion and in an overlying clamp. The latter has a body of resilient sheet metal, such as brass, bent into a casing around the projecting strip portion and a cantilevered tongue overlying the resinous block, a projection on that tongue bearing upon the block under pressure of the fastening screw.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.