Method for preparing diamond compacts containing single crystal diamond
US4260397A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 23, 1979 |
| Grant date | Apr 7, 1981 |
| Priority date | — |
| Expiry date | Aug 23, 1999 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J2203/0685
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improvement for making polycrystalline compacts containing single crystal diamonds embedded therein is disclosed. Cracking of such compacts is minimized by isolating the diamond in a relatively compressible matrix before exposing the sample to high pressure-high temperature sintering conditions. This may be done, for example, by mixing the diamond crystals with graphite or amorphous carbon powder. Useful devices which can be made from such compacts are cutting tools and wire drawing dies. A sectional view of a wire die blank of this invention is depicted in FIG. 3. One single crystal diamond 12 is embedded in polycrystalline diamond matrix 14 which has been sintered within cemented tungsten carbide ring 16. The wire is drawn through aperture 18. It is felt that this type of die would improve the wire finish while helping to prevent the failure of the single crystal through cleavage. It is useful in drawing wires made of such materials as tungsten, copper coated steel, copper and nickel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.