Adhesion test instrument
US4263811A · kind A · utility
5Cited by
3References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 1979 |
| Grant date | Apr 28, 1981 |
| Priority date | — |
| Expiry date | Jul 13, 1999 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Method and apparatus for measuring the normal stress required to remove an adhering thermoplastic rod from a substrate. Tensile strength of a bond can be measured reproducibly under controlled conditions. The tip of a thermoplastic rod, machined to a cone, is lowered into contact with a heated substrate and melting of the rod is allowed to proceed to a steady-state condition. After a bond is formed, the force required to break the bond is measured. The method permits rapid simulation of the essential conditions present during bond formation between a mineral filler surface and a polymer matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.