Apparatus for sticking nonconductive tape having plating perforations to sheet metal
US4264397A · kind A · utility
7Cited by
6References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 26, 1979 |
| Grant date | Apr 28, 1981 |
| Priority date | — |
| Expiry date | Sep 26, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1304
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for sticking nonconductive tape including plating perforations to sheet metal comprises supply means for metal tape, feed means for nonconductive tape, punching means for perforating nonconductive tape to make plating perforations therein, a device for heating and pressure-sticking the metal tape and the perforated nonconductive tape together, cooling means for the tapes, and control means for monitoring the position of the plating perforations and controlling the running speed of the nonconductive tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.