Selectively electrolessly depositing a metal pattern on the surface of a laminar film
US4264646A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1979 |
| Grant date | Apr 28, 1981 |
| Priority date | — |
| Expiry date | Mar 12, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0565
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method of selectively depositing a metal pattern on the surface of a laminar film comprising a dielectric substrate having a co-extensive metallic layer and a ceramic overlayer. A desired metallic pattern may be formed on the surface of the film by applying a releaseable mask in those regions of the film surface where plating of the surface is not desired, catalyzing the unmasked regions of the film surface, removing the mask from the film surface and thereafter immersing the film in an electroless plating bath whereby only the catalyzed regions are plated with the electroless metal of the bath. The preferred film has gold intermediate layer upon which electroless nickel or copper pattern plating is accomplished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.